Tagname : Level-4 autonomous driving
U.S. Adds SiC/GaN Power Chips to Export ControlsU.S. adds SiC/GaN power chips to export controls, reshaping compliance, lead times, and delivery risks. See what suppliers and buyers must act on now.- ASIC Design Cost Breakdown: What Drives NRE, Mask, IP, and Verification Costs?ASIC design cost breakdown explained for finance and procurement teams: uncover what drives NRE, mask, IP, and verification costs before approval to reduce risk and improve ROI.
- US Adds sub-7nm EDA and SiC/GaN Modules to ControlsUS adds sub-7nm EDA and SiC/GaN modules to controls. Learn how the BIS export rule affects China-facing semiconductor design, automotive sourcing, and compliance planning.
- Japan Tightens Export Controls on Solid-State Battery PrecursorsJapan tightens export controls on solid-state battery precursors, raising licensing hurdles for China-bound trade. See how METI’s move may impact costs, lead times, and EV project timelines.
- TSMC Sets Q3 2026 Sub-7nm Capacity RuleTSMC Sets Q3 2026 Sub-7nm Capacity Rule: learn how the new EDA verification gate could delay tape-out for AI, 6G, and autonomous driving chips—and what teams should do now.
- TSMC Opens 2026 Q3 Sub-7nm Capacity With EDA Certification RuleTSMC opens 2026 Q3 sub-7nm capacity with a new EDA certification rule. Learn how 7nm, 5nm, and 3nm scheduling changes could impact AI chips, tape-outs, and delivery timelines.
- ITC Opens 337 Probe Into Chinese Solid-State EVsITC opens 337 probe into Chinese solid-state EVs, putting autonomous driving exports, customs clearance, and U.S. sales at risk. See what it means for automakers, suppliers, and dealers now.
- METI Opens Fast-Track Path for L4 Platform ImportsMETI opens a fast-track path for L4 platform imports, cutting JIS A6001-2 approval to 12 working days for qualified firms. See who benefits, key compliance hurdles, and why this matters now.
{item.title}
{item.description}